3D tech for manufacturing

Agilent Technologies, an in-line 3D X-ray inspection system, can detect printed circuit board assembly (PCBA) solder and manufacturing assembly defects, reports Manufacturing.net.

The new system almost doubles the throughput of 3D solutions while using full 3D capability to find defects. It also enables 3D inspection of the PCBA at in-line speeds.

Previously, high-throughput 2D solutions have been used in limited applications where the PCBAs under test are predominately single-sided.

Sensicast Wireless Sensor Network (WSN) Systems launched a wireless system for pharmaceutical and life sciences facilities that need to monitor temperature, humidity, and other key data in their facilities, reports eMediaWire.

The new system collects data from 'smart sensors' installed at various points in labs, manufacturing, storage and shipping environments, and passes data to a company's network infrastructure. The information then becomes available to internal automation processes and control systems, and uses the data to provide alerts or baseline information.

Sensicast says the data retrieved off the network will help companies comply with FDA regulations, because the data can be easily retrieved and logged. It is also expected to lower costs.

EPCglobal announced its new industry standard for visibility of movement, location and disposition of assets, goods and services throughout the world, reports Manufacturing.net.

Electronic product code information services is expected to allow for the secure data exchange at all points of the goods and services lifecycle, as well as provide flexible information sharing for various industries.

The specification includes support for container tracking, product authentication, promotions management, baggage tracking, electronic proof of delivery, chain of custody, returns management, and operations management.